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INTERNATIONAL PATENT: YAZAKI CORPORATION, 矢崎総業株式会社 FILES APPLICATION FOR "ELECTRICAL CONNECTION UNIT"

Posted On: 2026-04-28
Government News US Fed News Patentwipo

GENEVA, April 28 -- YAZAKI CORPORATION (8-15, Konan 1-Chome, Minato-ku, Tokyo1080075), 矢崎総業株式会社 (東京都港区&#28207... Read More

INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "POLISHING METHOD, SLURRY AND ABRASIVE GRAINS"

Posted On: 2026-04-28
Government News US Fed News Patentwipo

GENEVA, April 28 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都&#2... Read More

INTERNATIONAL PATENT: PANASONIC HOLDINGS CORPORATION, パナソニックホールディングス株式会社, TOYOTA JIDOSHA KABUSHIKI KAISHA, トヨタ自動車株式会社 FILES APPLICATION FOR "CURRENT COLLECTOR, ELECTRODE, BATTERY AND METHOD FOR MANUFACTURING ELECTRODE"

Posted On: 2026-04-28
Government News US Fed News Patentwipo

GENEVA, April 28 -- PANASONIC HOLDINGS CORPORATION (1006, Oaza Kadoma, Kadoma-shi, Osaka5718501), パナソニックホールディン&#1246... Read More

INTERNATIONAL PATENT: NTT DOCOMO, INC., 株式会社ＮＴＴドコモ FILES APPLICATION FOR "TERMINAL AND COMMUNICATION METHOD"

Posted On: 2026-04-28
Government News US Fed News Patentwipo

GENEVA, April 28 -- NTT DOCOMO, INC. (11-1, Nagatacho 2-chome, Chiyoda-ku, Tokyo1006150), 株式会社ＮＴＴドコモ (東京都&#21... Read More

INTERNATIONAL PATENT: BANDAI CO.,LTD., 株式会社バンダイ FILES APPLICATION FOR "TOY"

Posted On: 2026-04-28
Government News US Fed News Patentwipo

GENEVA, April 28 -- BANDAI CO.,LTD. (4-8, Komagata 1-chome, Taito-ku, Tokyo1118081), 株式会社バンダイ (東京都台東区&... Read More

INTERNATIONAL PATENT: BANDAI CO.,LTD., 株式会社バンダイ FILES APPLICATION FOR "TOY"

Posted On: 2026-04-28
Government News US Fed News Patentwipo

GENEVA, April 28 -- BANDAI CO.,LTD. (4-8, Komagata 1-chome, Taito-ku, Tokyo1118081), 株式会社バンダイ (東京都台東区&... Read More

INTERNATIONAL PATENT: TELEXISTENCE INC., ＴＥＬＥＸＩＳＴＥＮＣＥ株式会社 FILES APPLICATION FOR "MERCHANDISE REPLENISHMENT SYSTEM, MANAGEMENT DEVICE, ROTARY RACK, UNPACKING UNIT AND PACKAGE TRANSFER UNIT"

Posted On: 2026-04-28
Government News US Fed News Patentwipo

GENEVA, April 28 -- TELEXISTENCE INC. (6-1-1, Heiwajima, Ota-ku, Tokyo1430006), Ｔｅｌｅｘｉｓｔｅｎｃｅ株式会... Read More

INTERNATIONAL PATENT: OHKAWA STRUCTURE DESIGN CO., LTD., 株式会社大川構造設計 FILES APPLICATION FOR "EARTH RETAINING STRUCTURE, PROGRAM FOR CALCULATING STABILITY AND STRESS LEVEL OF EARTH RETAINING STRUCTURE AND CONSTRUCTION METHOD FOR SAME"

Posted On: 2026-04-28
Government News US Fed News Patentwipo

GENEVA, April 28 -- OHKAWA STRUCTURE DESIGN CO., LTD. (1-9-43, Seta, Otsu-shi, Shiga5202134), 株式会社大川構造設計 (滋賀県... Read More

INTERNATIONAL PATENT: DENSO CORPORATION, 株式会社デンソー FILES APPLICATION FOR "INSPECTION DEVICE AND SEMICONDUCTOR CHIP PRODUCTION METHOD"

Posted On: 2026-04-28
Government News US Fed News Patentwipo

GENEVA, April 28 -- DENSO CORPORATION (1-1, Showa-cho, Kariya-city, Aichi4488661), 株式会社デンソー (愛知県刈谷市&#2... Read More

INTERNATIONAL PATENT: DENSO CORPORATION, 株式会社デンソー FILES APPLICATION FOR "INSPECTION DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP"

Posted On: 2026-04-28
Government News US Fed News Patentwipo

GENEVA, April 28 -- DENSO CORPORATION (1-1, Showa-cho, Kariya-city, Aichi4488661), 株式会社デンソー (愛知県刈谷市&#2... Read More